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IS31LT3932 Datasheet(PDF) 10 Page - Integrated Silicon Solution, Inc |
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IS31LT3932 Datasheet(HTML) 10 Page - Integrated Silicon Solution, Inc |
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10 / 12 page ![]() IS31LT3932 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 8/14/2013 10 Classification Reflow Profiles Profile Feature Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 150°C 200°C 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. Liquidous temperature (TL) Time at liquidous (tL) 217°C 60-150 seconds Peak package body temperature (Tp)* Max 260°C Time (tp)** within 5°C of the specified classification temperature (Tc) Max 30 seconds Average ramp-down rate (Tp to Tsmax) 6°C/second max. Time 25°C to peak temperature 8 minutes max. Classification Profile |
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