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TPS2012DR Datasheet(PDF) 5 Page - Texas Instruments

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No. de pieza TPS2012DR
Descripción Electrónicos  POWER-DISTRIBUTION
PDF  21 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS2012DR Datasheet(HTML) 5 Page - Texas Instruments

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TPS2010, TPS2011, TPS2012, TPS2013
POWER-DISTRIBUTION
SLVS097A – DECEMBER 1994 – REVISED AUGUST 1995
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
recommended operating conditions
MIN
MAX
UNIT
Input voltage, VI(IN)
2.7
5.5
V
Input voltage, VI at EN
0
5.5
V
TPS2010
0
0.2
Continuous output current IO
TPS2011
0
0.6
A
Continuous output current, IO
TPS2012
0
1
A
TPS2013
0
1.5
Operating virtual junction temperature, TJ
–40
125
°C
electrical characteristics over recommended operating junction temperature range, VI(IN) = 5.5 V,
IO = rated current, EN = 0 V (unless otherwise noted)
power switch
PARAMETER
TEST CONDITIONS†
TPS2010, TPS2011
TPS2012, TPS2013
UNIT
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VI(IN) = 5.5 V,
TJ = 25°C
75
95
On state resistance
VI(IN) = 4.5 V,
TJ = 25°C
80
110
m
On-state resistance
VI(IN) = 3 V,
TJ = 25°C
120
175
m
VI(IN) = 2.7 V,
TJ = 25°C
140
215
Output leakage current
EN
VI(IN)
TJ = 25°C
0.001
1
µA
Output leakage current
EN = VI(IN)
–40
°C ≤ TJ ≤ 125°C
10
µA
t
Output rise time
VI(IN) = 5.5 V,
TJ = 25°C,
CL = 1 µF
4
ms
tr
Output rise time
VI(IN) = 2.7 V,
TJ = 25°C,
CL = 1 µF
3.8
ms
tf
Output fall time
VI(IN) = 5.5 V,
TJ = 25°C,
CL = 1 µF
3.9
ms
tf
Output fall time
VI(IN) = 2.7 V,
TJ = 25°C,
CL = 1 µF
3.5
ms
† Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
enable input (EN)
PARAMETER
TEST CONDITIONS
TPS2010, TPS2011
TPS2012, TPS2013
UNIT
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
High-level input voltage
2.7 V
≤ VI(IN) ≤ 5.5 V
2
V
Low level input voltage
4.5 V
≤ VI(IN) ≤ 5.5 V
0.8
V
Low-level input voltage
2.7 V
≤ VI(IN) < 4.5 V
0.4
V
Input current
EN = 0 V or EN = VI(IN)
– 0.5
0.5
µA
tPLH Propagation (delay) time, low-to-high-level output
CL = 1 µF
20
ms
tPHL Propagation (delay) time, high-to-low-level output
CL = 1 µF
40
ms
current limit
PARAMETER
TEST CONDITIONS†
TPS2010, TPS2011
TPS2012, TPS2013
UNIT
TEST CONDITIONS
MIN
TYP
MAX
TJ =25°C
TPS2010
0.22
0.4
0.6
Short circuit current
TJ = 25 C,
VI(IN) = 5.5 V,
TPS2011
0.66
1.2
1.8
A
Short-circuit current
I(IN)
OUT connected to GND, device
enabled into short circuit
TPS2012
1.1
2
3
A
enabled into short circuit
TPS2013
1.65
2.6
4.5
† Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.



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