 |
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
|
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
AD9523-1/PCBZ Datasheet(PDF) 39 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
AD9523-1/PCBZ Datasheet(HTML) 39 Page - Analog Devices |
|
|
39 / 60 page  AD9523-1 Rev. B | Page 39 of 60 The second step is to multiply the power dissipated by the thermal impedance to determine the maximum power gradient. For this example, a thermal impedance of θJA = 20.1°C/W was used. Example 1 (966 mW × 20.1°C/W) = 19.4°C With an ambient temperature of 85°C, the junction temperature is TJ = 85°C + 19.4°C = 104°C This junction temperature is below the maximum allowable. Example 2 (2500 mW × 20.1°C/W) = 50.2°C With an ambient temperature of 85°C, the junction temperature is TJ = 85°C + 50°C = 135°C This junction temperature is above the maximum allowable. The ambient temperature must be lowered by 20°C to operate in the condition of Example 2. THERMALLY ENHANCED PACKAGE MOUNTING GUIDELINES Refer to the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), for more information about mounting devices with an exposed paddle. |
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Spanish ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
