• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

174

Chip Common Mode Choke Coil

!Caution/Notice

Do not use products beyond the rated current and rated

voltage as this may create excessive heat and

deteriorate the insulation resistance.

2. Mounting Direction

Mount Chip Common Mode Choke Coils in right

direction. Wrong direction, which is 90 degrees rotated

from right direction, causes not only open or short

circuit but also flames or other serious trouble.

q Notice (Soldering and Mounting)

<Operating Environment>

Do not use products in a chemical atmosphere such as

chlorine gas, acid or sulfide gas.

Do not use products in the environment close to the

organic solvent.

<Storage and Handling Requirements>

1. Storage Period

DLW11G/DLM2HG series should be used within 6

months, the other series should be used within 12

months.

Solderability should be checked if this period is

exceeded.

2. Storage Conditions

(1) Storage temperature: -10 to +40˚C

Relative humidity: 15 to 85%

Avoid sudden changes in temperature and humidity.

(2) Do not store products in a chemical atmosphere

such as chlorine gas, acid or sulfide gas.

1. Cleaning

Failure and degradation of a product are caused by

the cleaning method. When you clean in conditions

that are not in mounting information, please contact

Murata engineering.

2. Soldering

Reliability decreases with improper soldering methods.

Please solder by the standard soldering conditions

shown in mounting information.

3. Other

Noise suppression levels resulting from Murata's EMI

suppression filters EMIFILr may vary, depending on

the circuits and ICs used, type of noise, mounting

pattern, mounting location, and other operating

conditions. Be sure to check and confirm in advance

the noise suppression effect of each filter, in actual

circuits, etc. before applying the filter in a commercial-

purpose equipment design.

q Handling

1. Resin Coating (Except DLW Series.)

Using resin for coating/molding products may affect

the products performance.

So please pay careful attention in selecting resin.

Prior to use, please make the reliability evaluation with

the product mounted in your application set.

2. Resin Coating (DLW Series)

The impedance value may change due to high cure-

stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress

caused by the resin, amount/cured shape of resin, or

operating condition etc. Some resin contains some

impurities or chloride possible to generate chlorine by

hydrolysis under some operating condition may cause

corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention in selecting resin

in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no

reliability issue is observed by evaluating products

mounted on your board.

3. Caution for Use (DLW Series)

When you hold products with a tweezer, please hold

by the sides. Sharp materials, such as a pair of

tweezers, should not touch the winding portion to

prevent breaking the wire. Mechanical shock should

not be applied to the products mounted on the board

to prevent breaking the core.

4. Brushing

When you clean the neighborhood of products such

as connector pins, bristles of cleaning brush shall not

be touched to the winding portion of this product to

prevent the breaking of wire.

q Soldering and Mounting

1. Self-heating

Please provide special attention when mounting chip

common mode choke coils DLW5 series in close

proximity to other products that radiate heat.

The heat generated by other products may deteriorate

the insulation resistance and cause excessive heat in

this component.

right direction

wrong direction

Z

Z

q Storage and Operating Conditions

Notice

q Rating

!Caution

5. Handling of a Substrate

After mounting products on a substrate, do not apply

any stress to the product caused by bending or

twisting to the substrate when cropping the substrate,

inserting and removing a connector from the substrate

or tightening screw to the substrate. Excessive

mechanical stress may cause cracking in the Product.

Bending

Twisting