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CLD-AP70 Datasheet(PDF) 9 Page - Cree, Inc

No. de pieza CLD-AP70
Descripción Electrónicos  Cree/NXP Task Light Reference Design
PDF  11 Pages
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Fabricante Electrónico  CREE [Cree, Inc]
Página de inicio  http://www.cree.com/
Logo CREE - Cree, Inc

CLD-AP70 Datasheet(HTML) 9 Page - Cree, Inc

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NXP CREE TASK LIGHT REFERENCE DESIGN
Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree.com. For warranty information, please contact Cree Sales at sales@cree.com.
Thermal Management
Thermal management is critical in SSL luminaires. Ensuring the recommended maximum LED junction temperature is
not exceeded is critical to long life and color point stability of the LEDs. We designed an aluminum housing, increasing
the housing cost by 30% over a sheet metal version. This increased cost was offset by improved thermal performance
without the necessity of an additional heat sink. An aluminum housing allows the LED assembly to be produced with
standard FR-4 PCB material.
Thermal images of the LED board show that the system is well below the recommended maximum operating tempera-
tures of the components in the design.
Figure 11 shows a thermal view of the LED area of the LED task light. The temperature/time chart plots the maximum
temperature in the LED area versus time
Figure 11: Thermal view of LED task light
Figure 11 – part 1
Figure 11 – part 2



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