82563EB datasheet(45/52 Pages) INTEL

No. de pieza	82563EB

Descripción Electrónicos	82563EB/82564EB Gigabit Platform LAN Connect

PDF	52 Pages

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Fabricante Electrónico	INTEL [Intel Corporation]

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82563EB/82564EB Gigabit Platform LAN Connect Networking Silicon

5.2

Thermal Specifications

The 82563EB/82564EB device is specified for operation when the ambient temperature (TA) is

within the range of 0° C to 60° C.

The maximum junction temperature is 120° C. The maximum ambient temperature with airflow

and/or a heatsink can be calculated using the thermal coefficient data below and the power

specification (see section 4.7)

TC (case temperature) is calculated using the equation:

TC = TA + P (θJA - θJC)

TJ (junction temperature) is calculated using the equation:

TJ = TA + P θJA

P (power consumption) is calculated by using the typical ICC, as indicated in Table 38, and nominal

VCC. The preliminary thermal resistances are shown in Table 38.

Table 38. Thermal Characteristics

Value @ Given Airflow (m/s)

Symbol

Parameter

Units

θJ

Thermal Resistance, Junction to Ambient

26.1

22.9

21.7

21.1

°C/watt

θJ

Thermal Resistance, Junction to Case

12.7

°C/watt

82563EB Datasheet(PDF) 45 Page - Intel Corporation