AD8657ACPZ-R7 datasheet(21/24 Pages) AD

21 / 24 page

AD8657

Rev. A | Page 21 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

Figure 74. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

2.44

2.34

2.24

TOP VIEW

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

Figure 75. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-8-11)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

AD8657ARMZ

−40°C to +125°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

A2N

AD8657ARMZ-R7

−40°C to +125°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

A2N

AD8657ARMZ-RL

−40°C to +125°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

A2N

AD8657ACPZ-R7

−40°C to +125°C

8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-8-11

A2N

AD8657ACPZ-RL

−40°C to +125°C

8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-8-11

A2N

Z = RoHS Compliant Part.

AD8657ACPZ-R7 Datasheet(PDF) 21 Page - Analog Devices

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