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MCP6H74-E/ST Datasheet(PDF) 23 Page - Microchip Technology |
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MCP6H74-E/ST Datasheet(HTML) 23 Page - Microchip Technology |
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23 / 42 page ![]() 2012 Microchip Technology Inc. DS22325B-page 23 MCP6H71/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead SOIC (150 mil.) (MCP6H71, MCP6H72) Example: Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e Example: 8-Lead 2x3 TDFN (MCP6H71, MCP6H72) MCP6H71E SN ^^1232 256 3 e ABC 232 25 Part Number Code MCP6H71T-E/MNY ABC MCP6H72T-E/MNY ABD 14-Lead SOIC (150 mil) (MCP6H74) Example: YYWW NNN XXXXXXXX 14-Lead TSSOP (MCP6H74) Example: MCP6H74 E/SL 1232256 6H74E/ST 1232 256 |
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