Data Sheet

ADP1190

Rev. 0 | Page 11 of 12

OUTLINE DIMENSIONS

Figure 24. 12-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-12-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

ADP1190ACBZ-R7

−40°C to +85°C

12-Ball Wafer Level Chip Scale Package [WLCSP]

CB-12-10

LNE

1

Z = RoHS Compliant Part.

A

B

C

D

0.560

0.500

0.440

1.24

1.20

1.16

1.64

1.60

1.56

1

2

3

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

END VIEW

0.300

0.260

0.220

1.20

REF

0.80

REF

0.40

BSC

BALL A1

IDENTIFIER

SEATING

PLANE

0.230

0.200

0.170

0.330

0.300

0.270

COPLANARITY

0.04