AD5535B

Data Sheet

Rev. A | Page 16 of 16

OUTLINE DIMENSIONS

Figure 22. 124-Lead Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-124-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Function

Output Voltage Span

Temperature Range

Package Description

Package Option

AD5535BKBC

32 DACs

0 V to 200 V maximum

−10°C to +85°C

124-Lead CSP_BGA

BC-124-2

AD5535BKBCZ

32 DACs

0 V to 200 V maximum

−10°C to +85°C

124-Lead CSP_BGA

BC-124-2

EVAL-AD5535BEBZ

Evaluation Board

1

Z = RoHS Compliant Part.

DETAIL A

BALL DIAMETER

A

B

C

D

E

F

G

J

H

K

L

M

N

P

10

8 7 6

3 2 1

9

5 4

11

12

13

14

*1.25 MAX

0.85 MIN

*0.41

0.36

0.31

*0.46 NOM

*COMPLIANT WITH JEDEC STANDARDS MO-192-AAE-1

WITH EXCEPTION TO DIMENSIONS INDICATED BY AN ASTERISK.

NOMINAL BALL SIZE IS REDUCED FROM 0.60mm TO 0.46mm.

A1 BALL

CORNER

TOP VIEW

DETAIL A

BOTTOM VIEW

SEATING

PLANE

COPLANARITY

0.12

13.00

REF

15.10

15.00 SQ

14.90

BALL A1

PAD CORNER

1.00

BSC

1.70 MAX

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registered trademarks are the property of their respective owners.

D10852-0-4/13(A)