Preliminary Technical Data

ADD5211

Rev. PrA | Page 3 of 6

ABSOLUTE MAXIMUM RATINGS

Table 1.

Parameter

Rating

VIN, UVLO

−0.3 V to +45 V

FB1, FB2, FB3, FB4

−0.3 V to +55 V

EN

−0.3 V to +20 V

PWM, FAULT

−0.3 V to +10 V

VDR, GATE_N, GATE_P

−0.3 V to +7 V

VDD, LSD , OVP, CS, RAMP, SS

−0.3 V to +3.7 V

FREQ, ISET, COMP

−0.3 V to +3.5 V

AGND, PGND, LGND

−0.3 V to +0.3 V

150°C

−25°C to +85°C

−65°C to +150°C

Reflow Peak Temperature (20 sec to 40 sec)

260°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 2. Thermal Resistance

Package Type

Unit

24-Lead LFCSP

40.5

3.8

°C/W

ESD CAUTION