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TDA2822 Datasheet(PDF) 8 Page - STMicroelectronics |
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TDA2822 Datasheet(HTML) 8 Page - STMicroelectronics |
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8 / 11 page ![]() Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s) Figure 14 : Application Circuit for Portable Radios. MOUNTING INSTRUCTION The Rth j-amb of the TDA2822 can be reduced by sol- dering the GND pins to a suitable copper area of the printed circuit board (Figure 15) or to an external heatsink (Figure 16). The diagram of Figure 17 shows the maximum dis- sipable power Ptot and the Rth j-amb as a function of the side " ∂" of two equal square copper areas having a thickness of 35 µ (1.4 mils). During soldering the pins temperature must not ex- ceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 15 : Example of P.C. Board Copper Area which is used as Heatsink. Figure 16 : External Heatsink Mounting Example. TDA2822 8/11 |
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