DAMMP3C3PJ datasheet(31/301 Pages) ITT

31 / 301 page

Dimensions are shown in mm (inch)

Dimensions subject to change

D Subminiature

Cable Selection Guide

D* — Solder Cup Termination (Machined) with Tin Shells

D* solder cup connectors are used for cable or

panel mount wiring applications. Solder cup

connectors provide maximum flexibility and

performance for applications requiring discrete

solder terminations and field repair without

termination tooling.

Product Features

Machined solder cup termination, 5 A current

capacity

High performance commercial class

connectors

Two contact performance classes

Optional clinch nuts with #4-40 UNC or M3

threads

ZD* — Solder Cup Termination (Stamped) with Tin Shells

ZD* solder cup connectors are used for cable or

panel mount wiring applications. Solder cup

connectors provide maximum flexibility and

performance for applications requiring discrete

solder terminations.

Product Features

Stamped solder cup termination, 5 A current

capacity

Economical

D*A — Crimp Connectors without Contacts

D*A crimp contact connectors are designed for

reliable, fast cabling. Available in the industry

standard D*A housing, the connectors provide a

low-cost, quick cabling alternative compared to

soldering.

Product Features

Crimp contacts available in reels of 5,000

Application tooling:

– Hand or automatic

– Stripper crimper

D*W — Discrete Wire IDC

The D*W connector provides insulation

displacement connection technology for either

solid or stranded wires. With D*W, speed of

cabling is increased significantly over solder cup

or crimp solutions. Contacts are easily removable

and replaceable. Several specialized accessories

(including shield cans, ferrules, and plastic boots)

are available to provide a complete product

solution.

Product Features

Quick harnessing capability with simple hand

or semi-automatic tooling

Accepts 30 AWG to 20 AWG wire; sizes can

be mixed

Shield cans insure reliable shielding continuity

See pages 32-33.

See pages 34-35.

See pages 36-37.

See pages 38-41.

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