List of figures

STCD22x0, STCD23x0, STCD24x0

4/39

Doc ID 15400 Rev 2

List of figures

Figure 1.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 2.

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 3.

Hardware hookup (master clock enable active low) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 4.

Hardware hookup (master clock enable active high) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 5.

Connections diagram Flip Chip 12-bump (STCD22x0, 2-channel). . . . . . . . . . . . . . . . . . . . 8

Figure 6.

Connections diagram Flip Chip 12-bump (STCD23x0, 3-channel). . . . . . . . . . . . . . . . . . . . 9

Figure 7.

Connections diagram Flip Chip 16-bump (STCD24x0, 4-channel). . . . . . . . . . . . . . . . . . . . 9

Figure 8.

Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 9.

Typical application circuit using STCD24x0 for RF ends of TD-SCDMA/GSM dual-mode

mobile phone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 10.

Typical application circuit using STCD24x0 for baseband peripherals in mobile phone. . . 18

Figure 11.

Quiescent current vs. supply voltage (EN1 = EN2 = EN3 = EN4 = 1,

no master clock input). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 12.

Quiescent current vs. temperature (EN1 = EN2 = EN3 = EN4 = 1,

Cload = 20 pF, no master clock input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 13.

Active current vs. temperature (EN1 = EN2 = EN3 = EN4 = 1, Cload = 20 pF,

Figure 14.

Standby current vs. supply voltage (EN1 = EN2 = EN3 = EN4 = 0, no master clock input) 20

Figure 15.

Figure 16.

Active current vs. master clock input voltage level (EN1 = EN2 = EN3 = EN4 = 1,

Figure 17.

Active current vs. master clock frequency (EN1 = EN2 = EN3 = EN4 = 1, Cload = 20 pF) . 21

Figure 18.

STCD2400 recovery time from standby to active (VTCXO is on) . . . . . . . . . . . . . . . . . . . . 22

Figure 19.

STCD2400 recovery time from off to on (VTCXO first in standby) . . . . . . . . . . . . . . . . . . . 22

Figure 20.

Figure 21.

STCD2400 power-up sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 22.

STCD2400 power-down sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 23.

Phase noise input (from the clock source, 26 MHz square wave XO KC2520C26 from

Kyocera) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 24.

Phase noise output (include the clock source and STCD2400 additive phase noise) . . . . 26

Figure 25.

Flip Chip 12-bump, package mechanical outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Figure 26.

Flip Chip 16-bump, package mechanical outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 27.

Flip Chip 12-bump tape and reel specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 28.

Flip Chip 16-bump tape and reel specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36