Reel packing

COMPONENT

INNER

REEL

CARTON

APPROX.

PACKAGE

REEL SIZE

REEL

SPACING

BOX

BOX

DIA,

SIZE

CARTON

GROSS WEIGHT

(pcs)

(m/m)

(pcs)

(m/m)

(m/m)

(m/m)

(pcs)

(kg)

Page 6

RB520S

Formosa MS

SOD-523FL

7"

3000

4.0

30,000 183*183*123

178

240,000

382*262*387

9.5

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

Issued Date

Revised Date

Revision

Page.

Profile Feature

Soldering Condition

<3

/sec

Preheat

o

-Temperature Min(Tsmin)

150 C

o

-Temperature Max(Tsmax)

200 C

60~120sec

o

-Ramp-upRate

<3 C/sec

Time maintained above:

o

217 C

60~260sec

o

o

255 C-0/+5 C

o

Time within 5 C of actual Peak

o

Ramp-down Rate

<6 C/sec

o

Time 25 C to Peak Temperature

<6minutes

3.Reflow soldering

10~30sec

1.Storage environment: Temperature=5

~40

Humidity=55%±25%

2.Reflow soldering of surface-mount devices

o

o

C

C

Suggested thermal profiles for soldering processes

Critical Zone

TL to TP

TL

Tsmax

Tsmin

Ramp-up

Tp

tS

Preheat

o

t25 C to Peak

Time

25

TL

TP

Ramp-down

Small Signal Schottky Diode

DS-221674

2008/02/10

2010/07/12

C

7