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SST30VR021 Datasheet(PDF) 11 Page - Silicon Storage Technology, Inc |
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SST30VR021 Datasheet(HTML) 11 Page - Silicon Storage Technology, Inc |
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11 / 12 page ![]() Data Sheet 2 Mbit ROM + 1 Mbit / 2Mbit / 256 Kbit SRAM ROM/RAM Combo SST30VR021 / SST30VR022 / SST30VR023 11 ©2001 Silicon Storage Technology, Inc. S71135-02-000 4/01 380 PACKAGING DIAGRAMS 32-PIN THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM SST PACKAGE CODE: WH 32.TSOP-WH-ILL.4 Note: 1. Complies with JEDEC publication 95 MO-142 BA dimensions, although some dimensions may be more stringent. 2. All linear dimensions are in millimeters (min/max). 3. Coplanarity: 0.1 (±.05) mm. 4. Maximum allowable mold flash is 0.15mm at the package ends, and 0.25mm between leads. 8.10 7.90 .270 .170 1.05 0.95 .50 BSC 0.15 0.05 12.50 12.30 Pin # 1 Identifier 14.20 13.80 0.70 0.50 |
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