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FEATURES

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DIR

A1

A2

A3

A4

A5

A6

A7

A8

GND

OE

B1

B2

B3

B4

B5

B6

B7

B8

PW PACKAGE

(TOP VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74LVC245A-EP

OCTAL BUS TRANSCEIVER

WITH 3-STATE OUTPUTS

SCAS741B – DECEMBER 2003 – REVISED AUGUST 2005

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Controlled Baseline

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ESD Protection Exceeds JESD 22

– One Assembly/Test Site, One Fabrication

– 2000-V Human-Body Model (A114-A)

Site

– 1000-V Charged-Device Model (C101)

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Enhanced Diminishing Manufacturing

Sources (DMS) Support

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Enhanced Product-Change Notification

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Operates From 1.65 V to 3.6 V

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Inputs Accept Voltages to 5.5 V

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Max t

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Typical V

at V

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Typical V

V

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I

Operation

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Supports Mixed-Mode Signal Operation on All

Ports (5-V Input/Output Voltage With 3.3-V

V

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Latch-Up Performance Exceeds 250 mA Per

JESD 17

(1)

Component qualification in accordance with JEDEC and

industry standards to ensure reliable operation over an

extended temperature range. This includes, but is not limited

to, Highly Accelerated Stress Test (HAST) or biased 85/85,

temperature cycle, autoclave or unbiased HAST,

electromigration, bond intermetallic life, and mold compound

life. Such qualification testing should not be viewed as

justifying use of this component beyond specified

performance and environmental limits.

The SN74LVC245A is designed for asynchronous communication between data buses. The device transmits

data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the

direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are

effectively isolated.

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in

a mixed 3.3-V/5-V system environment.

ORDERING INFORMATION

ORDERABLE PART NUMBER

TOP-SIDE MARKING

–40

°C to 85°C

TSSOP – PW

Reel of 2000

SN74LVC245AIPWREP

C245AEP

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.