MPC5643L datasheet(78/136 Pages) FREESCALE

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MPC5643L Microcontroller Data Sheet, Rev. 8.1

Electrical characteristics

Freescale Semiconductor

3.4

Thermal characteristics

VDD_LV_REGCOR

3 SR Internal supply voltage

—

VSS_LV_REGCOR

4 SR Internal reference voltage

—

VDD_LV_CORx

SR Internal supply voltage

—

VSS_LV_CORx

SR Internal reference voltage

—

VDD_LV_PLL

SR Internal supply voltage

—

VSS_LV_PLL

SR Internal reference voltage

—

SR Ambient temperature under bias

fCPU  120 MHz

–40

125

°C

SR Junction temperature under bias

—

–40

150

°C

1 Full functionality cannot be guaranteed when voltage drops below 3.0 V. In particular, ADC electrical characteristics

and I/Os DC electrical specification may not be guaranteed.

2 V

DD_HV_ADR0 and VDD_HV_ADR1 cannot be operated at different voltages, and need to be supplied by the same

voltage source.

3 Can be connected to emitter of external NPN. Low voltage supplies are not under user control. They are produced

by an on-chip voltage regulator.

4 For the device to function properly, the low voltage grounds (V

SS_LV_xxx) must be shorted to high voltage grounds

(VSS_HV_xxx) and the low voltage supply pins (VDD_LV_xxx) must be connected to the external ballast emitter, if one

is used.

Table 10. Thermal characteristics for 100 LQFP package1

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

Symbol

Parameter

Conditions

Value Unit

RJA

Thermal resistance, junction-to-ambient natural

convection2

2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board – 1s

°C/W

Four layer board – 2s2p

RJMA

Thermal resistance, junction-to-ambient forced

convection at 200 ft/min

Single layer board – 1s

°C/W

Four layer board – 2s2p

RJB

Thermal resistance junction-to-board3

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

—19

°C/W

RJC

Thermal resistance junction-to-case4

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

—8

°C/W



Junction-to-package-top natural convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

—2

°C/W

Table 9. Recommended operating conditions (3.3 V) (continued)

Symbol

Parameter

Conditions

Min1

Max

Unit

MPC5643L Datasheet(PDF) 78 Page - Freescale Semiconductor, Inc

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