MMG3003NT1

17

RF Device Data

Freescale Semiconductor, Inc.

PRODUCT DOCUMENTATION AND SOFTWARE

Refer to the following documents and software to aid your design process.

Application Notes

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

• AN3100: General Purpose Amplifier and MMIC Biasing

Software

• .s2p File

For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software &

Tools tab on the part’s Product Summary page to download the respective tool.

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

5

Mar. 2007

• Corrected and updated Part Numbers in Tables 8, 10, 11, 12, and 13, Component Designations and Values,

to RoHS compliant part numbers, p. 6--10

6

July 2007

• Replaced Case Outline 1514--01 with 1514--02, Issue D, p. 1, 14--16. Case updated to add missing

dimension for Pin 1 and Pin 3.

7

Mar. 2008

• Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,

p. 1

• Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis

(ACPR) unit of measure to dBc, p. 5

• Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected

frequency values from GHz to MHz, p. 11, 12

8

Feb. 2012

• Corrected temperature at which ThetaJC is measured from 25°C to 109°C and added “no RF applied” to

Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no

RF signal applied, p. 1

• Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD

ratings are characterized during new product development but are not 100% tested during production. ESD

ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive

devices, p. 3

as bias is not a controlled value, p. 4--12

• Added .s2p File availability to Product Software, p. 17