ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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Suggested Pad Layout

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U-QFN3030-16 Type B

Dimensions

Value

(in mm)

C

0.500

G

0.150

G1

0.150

X

0.350

X1

1.800

Y

0.600

Y1

1.800

U-QFN4040-16 Type C

Dimensions

Value

(in mm)

C

0.650

X

0.400

X1

2.075

X2

0.550

X3

2.075

X4

4.400

Y

0.650

Y1

0.400

Y2

1.225

Y3

2.075

Y4

0.550

Y5

4.400

X (16x)

Y (16x)

C

Y1

X1

G1

G

1

Y2

Y3

X3

Y5

X1

C

Y (4x)

X (8x)

X2 (8x)

X4

Y1 (8x)

Y4 (4x)