CPC1972

www.clare.com

5

R04

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all

of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry

standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to

the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled

according to the limitations and information in that standard as well as to any limitations set forth in the information or

standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according

to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device

Moisture Sensitivity Level (MSL) Rating

CPC1972G / CPC1972GS

MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020

must be observed.

Device

Maximum Temperature x Time

CPC1972G / CPC1972GS

250ºC for 30 seconds

Board Wash

Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is

acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated

products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes.

Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy

should not be used.

RoHS

2002/95/EC

Pb