He

epc701/epc703

Reflow Solder Profile

For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for

Tape & Reel Information

The devices are packaged into embossed tapes for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13

inch) reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indic-

ate the tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association (EIA)

standard 481-1, 481-2, 481-3.

Pin 1

Pin 1

8

2

CSP6 Tape

QFN16 Tape

Pin 1

Pin 1

8

4

CSP6 Tape

QFN16 Tape

epc does not guarantee that there are no empty cavities in the tape. Thus, the pick-and-place machine should check the presence of a chip

during picking.

Ordering Information

Part Number

Package

RoHS compliance

Packaging Method

epc700-CSP6

CSP6

Yes

Reel

epc700-QFN16

QFN16

Yes

Reel

epc701-CSP6

CSP6

Yes

Reel

epc701-QFN16

QFN16

Yes

Reel

epc702-CSP6

CSP6

Yes

Reel

epc702-QFN16

QFN16

Yes

Reel

epc703-CSP6

CSP6

Yes

Reel

epc703-QFN16

QFN16

Yes

Reel

© 2011 ESPROS Photonics Corporation

Characteristics subject to change without notice

10

Datasheet epc701_703 - V2.2

www.espros.ch