W25Q16CLZPIP datasheet(69/77 Pages) WINBOND

No. de pieza	W25Q16CLZPIP

Descripción Electrónicos	2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

PDF	77 Pages

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Fabricante Electrónico	WINBOND [Winbond]

Página de inicio	http://www.winbond.com

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69 / 77 page

W25Q16CL

Publication Release Date: July 08, 2010

- 69 -

Preliminary - Revision A

13. PACKAGE SPECIFICATION

13.1 8-Pin SOIC 150-mil (Package Code SN)

SEATING PLANE

0.25

GAUGE PLANE

E H

SEATING PLANE

0.25

GAUGE PLANE

E H

MILLIMETERS

INCHES

SYMBOL

Min

Max

Min

Max

1.35

1.75

0.053

0.069

0.10

0.25

0.004

0.010

0.33

0.51

0.013

0.020

0.19

0.25

0.008

0.010

(3)

3.80

4.00

0.150

0.157

(3)

4.80

5.00

0.188

0.196

(2)

1.27 BSC

0.050 BSC

5.80

6.20

0.228

0.244

(4)

---

0.10

---

0.004

0.40

1.27

0.016

0.050

0°

10°

0°

10°

Notes:

1. Controlling dimensions: millimeters, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.

W25Q16CLZPIP Datasheet(PDF) 69 Page - Winbond

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