7

ã 2001 Semtech Corp.

www.semtech.com

SC1566

POWER MANAGEMENT

(

W

/

C

33

R

therefore

,

W

/

C

0

R

and

W

/

C

3

R

W

/

C

36

81

.

1

85

150

P

T

T

R

)

MAX

)(

A

S

(

TH

)

S

C

(

TH

)

MAX

)(

C

J

(

TH

)

MAX

(

D

)

MAX

(

A

)

MAX

(

J

)

MAX

)(

A

J

(

TH

°

=

°

=

°

=

°

=

−

=

−

=

−

−

−

−

Applications Information (Cont.)

This should be achievable for the TO-263 package using

pcb copper area to aid in conducting the heat away from

the device, such as a large (~2 squ. inch) pad connected

to the tab of the device. Internal ground/power planes

and air flow will also assist in removing heat. For higher

power dissipations it may be necessary to use a small

heatsink and the TO-220 package.

Outline Drawing - T0-263-3

Minimum Land Pattern - TO-263-3