ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 38

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Suggested Pad Layout

© Diodes Incorporated

DFN3030-4

DFN3030-8

Y

X (4x)

C

Y3 (2x)

Y2

Y1

G1

G3

G4

R

G7

G8

X3

G5

X1

X2

G2

G6

Dimensions

Value (in mm)

C

1.300

G1

0.100

G2

0.150

G3

0.830

G4

0.115

G5

0.135

G6

0.170

G7

0.500

G8

0.500

R

0.150

X

0.500

X1

1.375

X2

1.225

X3

1.175

Y

1.980

Y1

1.015

Y2

0.715

Y3

0.650

Z

G

X1

X2

YC

Dimensions Value (in mm)

Z

2.59

G

0.11

X1

2.49

X2

0.65

Y

0.39

C

0.65

DFN3030E-8

Y

(x8)

X (x8)

C

C1

Y1

Y2

Dimensions

Value (in mm)

C

0.65

C1

2.35

X

0.30

Y

0.65

Y1

1.60

Y2

2.75

DFN3030-10

DFN3030-12

C

Y

Z

X

X1

G

G

Dimensions Value (in mm)

Z

2.60

G

0.15

X

1.80

X1

0.60

Y

0.30

C

0.50

C

Y

Z

X

X1

G

G

Dimensions Value (in mm)

Z

2.60

G

0.15

X

1.80

X1

0.60

Y

0.28

C

0.45