| Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
MPC8377E Datasheet(PDF) 89 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
MPC8377E Datasheet(HTML) 89 Page - Freescale Semiconductor, Inc |
|
89 / 126 page ![]() MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4 Freescale Semiconductor 89 Package and Pin Listings Figure 63 shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II package. Figure 63. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II Note: 1 All dimensions are in millimeters. 2 Dimensioning and tolerancing per ASME Y14. 5M-1994. 3 Maximum solder ball diameter measured parallel to Datum A. 4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5 Parallelism measurement should exclude any effect of mark on top surface of package. |
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |