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MPC8315ECVRAGDA Datasheet(PDF) 81 Page - Freescale Semiconductor, Inc |
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MPC8315ECVRAGDA Datasheet(HTML) 81 Page - Freescale Semiconductor, Inc |
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81 / 112 page ![]() MPC8315E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 0 Freescale Semiconductor 81 Package and Pin Listings 23.2 Mechanical Dimensions of the TEPBGA II Figure 61 the mechanical dimensions and bottom surface nomenclature of the 620-pin TEPBGA II package. Figure 61. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II 23.3 Pinout Listings Table 70 provides the pin-out listing for the TEPBGA II package. Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. |
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