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Datasheet

Boxed Processor Specifications

7.3

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the boxed

processor.

7.3.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's

temperature specification is also a function of the thermal design of the entire system, and

ultimately the responsibility of the system integrator. The processor temperature specification is in

Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature within the

specifications (see Table 5-1) in chassis that provide good thermal management. For the boxed

processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink

is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.

Airspace is required around the fan to ensure that the airflow through the fan heatsink is not

blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan

life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. The

air temperature entering the fan should be kept below 38 ºC. Again, meeting the processor's

temperature specification is the responsibility of the system integrator.

Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket

R4.33

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521 Datasheet(PDF) 93 Page - Intel Corporation