234

Communication ICs

BA6569AS / BA6569AFP

FOperation notes

The maximum power dissipation for the BA6569AS is

1100mW, and for the BA6569AFP, the maximum power

dissipation is 1200mW (when mounted on 90mm

50mm

1.6mm glass epoxy boards, however, fins

should be soldered to the foil pattern). Since the maxi-

mum power dissipation varies with temperature, the

product of the applied voltage VL and the total current

drawn by the IC, after factoring in the temperature,

should not exceed the maximum dissipation.