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BUsage Recommendations

Manual soldering: 340±10ç for 3 seconds

Thickness: 0.12 mm

Open area ratio: Receptacle:80%, Plug: 70%

Maximum of 0.02 mm at the connector center, with both ends of the

connector as reference points.

Cleaning is not recommended. When cleaning, please evaluate as it

can deteriorate the performance including mechanical operation and

environmental resistance.

s Mating and un-mating of the connectors when not soldered on the

boards is not recommended as this may cause deformation of the

terminals, damage to the contacts or insulators.

s Mated connectors should not carry weight of the board by

themselves. Provide some other support of the boards.

s When mating/un-mating do not twist or lift by the corners. Apply the

forces evenly across the entire length and width of the connectors

taking care NOT to damage or deform soldered terminations.

s Exercise extreme caution when mating/ un-mating when the

connector is mounted on a nonrigid (flexible) substrate.

Slight discoloration on the insulating materials will not affect form,

fit or function of the connectors.

s Do NOT pull on the flexible substrate.

Note 1: Up to 2 cycles of Reflow soldering are possible under the

same conditions, provided that there is a return to normal

temperature between the first and second cycle.

Note 2: The temperature profile indicates the board surface

temperature at the point of contacts with the connector

terminals.

50

60sec max

100

150

200

250

Time (sec.)

Temperature (ç)

0

100

150

200

250

50

Room temperature

300

90~120sec

180ç

250ç

220ç

150ç

1.Recommended temperature profile

2.Recommended manual soldering

3.Recommended screen thickness and open

area ratio (Pattern area ratio)

4.Board warpage

5.Cleaning conditions

6.Precautions

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.