QSOP24 NB

CASE 492Bï01

ISSUE A

DATE 06 MAY 2008

SCALE 2:1

E

M

0.25

C

A1

A

C

DETAIL A

DETAIL A

h x 45 _

DIM

MAX

MIN

MILLIMETERS

A

1.35

1.75

b

0.20

0.30

L

0.40

1.27

e

0.635 BSC

h

0.22

0.50

C

0.19

0.25

A1

0.10

0.25

M

0

8

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION.

4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH,

PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE. DIMENSION E1 DOES NOT

INCLUDE INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL NOT

EXCEED 0.15 PER SIDE. D AND E1 ARE

DETERMINED AT DATUM H.

5. DATUMS A AND B ARE DETERMINED AT DATUM H.

_

_

b

L

6.40

24X

0.42

24X

1.12

0.635

DIMENSIONS: MILLIMETERS

24

PITCH

SOLDERING FOOTPRINT

13

1

12

D

D

24X

SEATING

PLANE

0.10 C

E1

A

A-B D

0.20 C

e

1

12

24

13

24X

C

M

xxx

= Specific Device Code

A

= Assembly Location

WL

= Wafer Lot

Y

= Year

WW

= Work Week

xxxxxxxxx

AWLYWW

GENERIC

MARKING DIAGRAM*

*This information is generic. Please refer

to device data sheet for actual part

marking. PbïFree indicator, “G”, may

or not be present.

D

8.65 BSC

E

6.00 BSC

E1

3.90 BSC

L2

0.25 BSC

D

0.25 C D

B

0.20 C D

2X

2X

2X 12 TIPS

0.10 C

H

L2

GAUGE

PLANE

C

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