LTC6255/LTC6256/LTC6257



625567f

pAckAge Description

MS8Package

8-LeadPlasticMSOP

(ReferenceLTCDWG#05-08-1660RevF)

MSOP (MS8) 0307 REV F

0.53 0.152

(.021 .006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.18

(.007)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.1016 0.0508

(.004 .002)

0.86

(.034)

REF

0.65

(.0256)

BSC

0 – 6 TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

1 2 3 4

4.90 0.152

(.193 .006)

8 7 6 5

3.00 0.102

(.118 .004)

(NOTE 3)

3.00 0.102

(.118 .004)

(NOTE 4)

0.52

(.0205)

REF

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889 0.127

(.035 .005)

RECOMMENDED SOLDER PAD LAYOUT

0.42 0.038

(.0165 .0015)

TYP

0.65

(.0256)

BSC