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IR3521 Datasheet(PDF) 41 Page - International Rectifier |
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IR3521 Datasheet(HTML) 41 Page - International Rectifier |
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41 / 45 page ![]() IR3521 Page 41 V3.03 PCB METAL AND COMPONENT PLACEMENT Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be ≥ 0.2mm to prevent shorting. Lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm inboard extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard extension will accommodate any part misalignment and ensure a fillet. Center pad land length and width should be equal to maximum part pad length and width. However, the minimum metal to metal spacing should be ≥ 0.17mm for 2 oz. Copper (≥ 0.1mm for 1 oz. Copper and ≥ 0.23mm for 3 oz. Copper) Four 0.30mm diameter vias shall be placed in the center of the pad land and connected to ground to minimize the noise effect on the IC. No pcb traces should be routed nor vias placed under any of the 4 corners of the IC package. Doing so can cause the IC to rise up from the pcb resulting in poor solder joints to the IC leads. |
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