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MPX5100AP Datasheet(PDF) 10 Page - Freescale Semiconductor, Inc |
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MPX5100AP Datasheet(HTML) 10 Page - Freescale Semiconductor, Inc |
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10 / 17 page ![]() MPX5100 Sensors 10 Freescale Semiconductor Pressure CASE 867-08 ISSUE N UNIBODY PACKAGE CASE 867C-05 ISSUE F UNIBODY PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX R X 12 3 4 5 6 DIM MIN MAX MIN MAX MILLIMETERS INCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93 W 0.310 0.330 7.87 8.38 X 0.248 0.278 6.30 7.06 PORT #2 VACUUM (P2) PORT #1 POSITIVE PORT #1 PIN 1 PORT #2 POSITIVE VACUUM PRESSURE SEATING PLANE SEATING PLANE –T– –T– P G C J N B F D W V L U 6 PL S K –Q– –A– M Q M 0.25 (0.010) T M A M 0.13 (0.005) PRESSURE (P1) 0.220 0.240 5.59 6.10 (P1) (P2) PIN 1 F G N L R 12 34 5 6 6 PL D SEATING PLANE -T- M A M 0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPLY 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPLY 5. +VOUT 6. OPEN MAX MILLIMETERS INCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: 1. 2. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). |
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