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PSII30/06 Datasheet(PDF) 1 Page - Powersem GmbH |
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PSII30/06 Datasheet(HTML) 1 Page - Powersem GmbH |
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1 / 4 page  tentative data sheet product still under development IGBT Module I C80 = 29 A V CES = 600 V V CE(sat)typ. = 2.4 V POWERSEM GmbH, Walpersdorfer Str. 53 D - 91126 Schwabach Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20 2005 POWERSEM reserves the right to change limits, test conditions and dimensions Preliminary Data Sheet Caution: These Devices are sensitive to electrostatic discharge. Users should observe proper ESD handling precautions. PSII 30/06* *NTC optional Short Circuit SOA Capability Square RBSOA IGBTs Symbol Conditions Maximum Ratings V CES T VJ = 25°C to 150°C 600 V V GES ± 20 V I C25 T C = 25°C 42.5 A I C80 T C = 80°C 29 A I CM V GE = ±15 V; RG = 33 Ω; TVJ = 125°C 60 A V CEK RBSOA, Clamped inductive load; L = 100 µH V CES t SC V CE = VCES; VGE = ±15 V; RG = 33 Ω; TVJ = 125°C 10 µs (SCSOA) non-repetitive P tot T C = 25°C 130 W Symbol Conditions Characteristic Values (T VJ = 25°C, unless otherwise specified) min. typ. max. V CE(sat) I C = 50 A; VGE = 15 V; TVJ = 25°C 2.4 2.9 V T VJ = 125°C 2.9 V V GE(th) I C = 0.7 mA; VGE = VCE 4.5 6.5 V I CES V CE = VCES;VGE = 0 V; T VJ = 25°C 0.6 mA T VJ = 125°C 1.7 mA I GES V CE = 0 V; VGE = ± 20 V 100 nA t d(on) 50 ns t r 50 ns t d(off) 270 ns t f 40 ns E on 1.4 mJ E off 1.0 mJ C ies V CE = 25 V; VGE = 0 V; f = 1 MHz 16 nF R thJC (per IGBT) 0.96 K/W R thJH with heatsink compound (0.42 K/m.K; 50 µm) 1.92 K/W Inductive load, T VJ = 125°C V CE = 300 V; IC = 30 A V GE = 15/0 V; RG = 33 Ω V3 V6 N1 G1 Q1 V10 V9 N15 K1 V13 V12 G15 V1 U1 A1 S15 D1 A9 A7 A15 R15 Features • Package with DCB ceramic base plate • Isolation voltage 3000 V ∼ • Planar glass passivated chips • Low forward voltage drop • Leads suitable for PC board soldering • UL Release applied Applications • AC and DC motor control • AC servo and robot drives • Power supplies • Welding inverters Advantages • Easy to mount with four screws • Space and weight savings • Improved temperature and power cycling capability • High power density • Small and light weight ECO-TOPTM 1 typical picture, for pin configuration see outline drawing |
Número de pieza similar - PSII30/06 |
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Descripción similar - PSII30/06 |
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