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20 Alpha Road Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

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8

HMC309MS8

v03.0304

Outline Drawing

Absolute Maximum Ratings

GaAs MMIC 2.4 GHz FRONT-END

LNA / SWITCH

NOTES:

1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED

PLASTIC SILICA AND SILICON IMPREGNATED.

2. LEADFRAME MATERIAL: COPPER ALLOY

3. LEADFRAME PLATING: Sn/Pb SOLDER

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.

Drain Bias Voltage (Vdd)

+8.0 Vdc

Control Voltage Range (CTL)

-0.2V to Vdd

Input Power @ ANT

(LNA “ON”, Vdd = +3.0 Vdc)

+10 dBm

Input Power @ Tx

(Switch “ON”, Vdd = +3.0 Vdc)

+34 dBm

Channel Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 0.6 mW/°C above 85 °C)

0.039 W

Thermal Resistance

(channel to lead)

1666 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C