AS1371 datasheet(10/14 Pages) AMSCO

No. de pieza	AS1371

Descripción Electrónicos	400mA, Low Input Voltage, Low Quiescent Current LDO

PDF	14 Pages

Scroll/Zoom	100%

Fabricante Electrónico	AMSCO [ams AG]

Página de inicio	http://www.ams.com

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Revision 1.04

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AS1371

Datasheet - D e t a i l e d D e s c r i p t i o n

Operating Region and Power Dissipation

Maximum power dissipation is determined by the thermal resistance of the case and circuit board, the temperature

difference between the die junction and ambient air, and the rate of air flow. The power dissipation of the device is

calculated by:

Maximum power dissipation is calculated by:

Where:

TJ - TAMB is the temperature difference between the device die junction and the surrounding air.

θJB is the thermal resistance of the package.

θJA is the thermal resistance through the circuit board, copper traces, and other materials to the surrounding.

Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin

should be connected to the system ground using a large pad or a ground plane.

(EQ 2)

OUT

–

()

(EQ 3)

MAX

AMB

–

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AS1371 Datasheet(PDF) 10 Page - ams AG