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Revision 1.10

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AS1340

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VCC, FB, EN to GND

7

V

SWVIN, SWOUT to GND

7

LX to GND

55

Thermal Resistance

36.7

ºC/W

on PCB

ESD

1.5

kV

HBM MIL-Std. 883E 3015.7 methods

Latch-Up

-100

+100

mA

JEDEC 78

Operating Temperature Range

-40

+85

ºC

Storage Temperature Range

-65

+150

ºC

Junction Temperature

125

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020D “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).