SE97TP datasheet(45/55 Pages) NXP

No. de pieza	SE97TP

Descripción Electrónicos	DDR memory module temp sensor with integrated SPD, 3.3 V

PDF	55 Pages

Scroll/Zoom	100%

Fabricante Electrónico	NXP [NXP Semiconductors]

Página de inicio	http://www.nxp.com

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45 / 55 page

SE97_7

Product data sheet

Rev. 07 — 29 January 2010

45 of 55

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

12. Package outline

Fig 41. Package outline SOT530-1 (TSSOP8)

UNIT

max.

D(1)

E(2)

Z(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15

0.05

0.95

0.85

0.30

0.19

0.20

0.13

3.1

2.9

4.5

4.3

0.65

6.5

6.3

0.70

0.35

0.1

0.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.7

0.5

SOT530-1

MO-153

00-02-24

03-02-18

w M

0.25

(A3)

detail X

v M A

2.5

5 mm

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm

SOT530-1

1.1

pin 1 index

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