MB4516 datasheet(1/6 Pages) ABC

No. de pieza	MB4516

Descripción Electrónicos	HIGH CURRENT MULTILAYER CHIP BEAD

PDF	6 Pages

Scroll/Zoom	100%

Fabricante Electrónico	ABC [ABC Taiwan Electronics Corp]

Página de inicio	http://www.atec-group.com

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1 / 6 page

REF :

PAGE: 1

SPECIFICATION FOR APPROVAL

PROD.

NAME

ABC'S DWG NO.

ABC'S ITEM NO.

Ⅰ﹒CONFIGURATION & DIMENSIONS：

Ⅱ﹒SCHEMATIC DIAGRAM：

Ⅲ﹒MATERIALS：

Ⅳ﹒GENERAL SPECIFICATION：

a﹒Body：Ferrite

b﹒Internal conductor：Silver or Ag / Pd

c﹒Terminal strength：

a﹒Storage temp.：-40℃ ---- +105℃

b﹒Operating temp.：-55℃ ---- +125℃

Series

A

B

C

DH

GI

Unit : m/m

D

B

( PCB Pattern )

I

G

I

F

Type

F ( kgf )

Time ( sec )

MB4532

30±5

0.6±0.4

MB4532

3.2±0.2

4.5±0.2

1.5±0.2

3.0

1.5

MB4516

MB3261

4.5±0.2

3.2±0.2

1.6±0.2

1.1±0.2

3.0

2.2

1.4

1.5

1.1

0.6±0.4

MB4516

MB3261

a

c

b

MB2029

MB1608

0.9±0.2

0.8±0.2

2.0±0.2

1.6±0.2

1.2±0.2

0.8±0.2

0.5±0.3

0.3±0.2

1.0

0.7

1.0

0.7

MB1608

MB2029

1.5

1.0

0.5

0.6

A

AR-001A

0

100

50

150

Time ( seconds )

50

100

200

250

70sec max.

200

250

260℃

50sec max.

230℃

P eak Temperature:

Peak Temp：260℃ max.

Max time above 2 30℃ ：50sec max.

Max time above 2 00℃ ：70sec max.

Rising Area

+4.0

/ sec max.

℃

Temperature

150 ~ 200

/ 60 ~ 120 sec

℃

Preheat Area

-(1.0 ~ 5.0)

/ sec max.

℃

Forced Cooling Area

+2.0 ~ 4.0℃

/ sec max.

Reflow Area

c﹒Terminal：Ag/Ni/Sn

d﹒Solderability：

Solder temp. : 260±5℃

Solder : Sn96.5 / Ag3 / Cu0.5

Dip time : 4±1 seconds

Flux : Rosin

or equivalent

MB□□□□□□□□L□-□□□

d﹒Remark：Products comply with RoHS'

requirements

HIGH CURRENT MULTILAYER

CHIP BEAD

20090527-A

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