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MPC8544EBVTALF Datasheet(PDF) 110 Page - Freescale Semiconductor, Inc

No. de pieza MPC8544EBVTALF
Descripción Electrónicos  PowerQUICC??III Integrated Processor Hardware Specifications
PDF  120 Pages
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Fabricante Electrónico  FREESCALE [Freescale Semiconductor, Inc]
Página de inicio  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8544EBVTALF Datasheet(HTML) 110 Page - Freescale Semiconductor, Inc

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MPC8544E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3
110
Freescale Semiconductor
System Design Information
remain unconnected. Power and ground connections must be made to all external VDD, TVDD, BVDD,
OVDD, GVDD, and LVDD, and GND pins of the device.
21.6
Pull-Up and Pull-Down Resistor Requirements
The MPC8544E requires weak pull-up resistors (2–10 k
Ω is recommended) on open drain type pins
including I2C pins and MPIC interrupt pins.
Correct operation of the JTAG interface requires configuration of a group of system control pins as
demonstrated in Figure 69. Care must be taken to ensure that these pins are maintained at a valid deasserted
state under normal operating conditions as most have asynchronous behavior and spurious assertion will
give unpredictable results.
The following pins must NOT be pulled down during power-on reset: TSEC3_TXD[3], HRESET_REQ,
TRIG_OUT/READY/QUIESCE, MSRCID[2:4], ASLEEP. The DMA_DACK[0:1] and TEST_SEL pins
must be set to a proper state during POR configuration. Refer to the pinout listing table (Table 62) for more
details. Refer to the PCI 2.2 Local Bus Specifications, for all pullups required for PCI.
21.7
Output Buffer DC Impedance
The MPC8544E drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C). To measure Z0 for the single-ended drivers,
an external resistor is connected from the chip pad to OVDD or GND. Then, the value of each resistor is
varied until the pad voltage is OVDD/2 (see Figure 67). The output impedance is the average of two
components, the resistances of the pull-up and pull-down devices. When data is held high, SW1 is closed
(SW2 is open) and RP is trimmed until the voltage at the pad equals OVDD/2. RP then becomes the
resistance of the pull-up devices. RP and RN are designed to be close to each other in value. Then,
Z0 =(RP +RN)/2.
Figure 67. Driver Impedance Measurement
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2



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