MPC8544EBVTALF datasheet(30/120 Pages) FREESCALE

30 / 120 page

MPC8544E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3

Freescale Semiconductor

Enhanced Three-Speed Ethernet (eTSEC), MII Management

Figure 9. Receive Input Compliance Mask

Figure 10 provides the AC test load for SGMII.

Figure 10. SGMII AC Test/Measurement Load

8.5

FIFO, GMII,MII, TBI, RGMII, RMII, and RTBI AC Timing

Specifications

The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI are presented in this

section.

8.5.1

FIFO AC Specifications

The basis for the AC specifications for the eTSEC FIFO modes is the double data rate RGMII and RTBI

specifications, since they have similar performance and are described in a source-synchronous fashion like

FIFO modes. However, the FIFO interface provides deliberate skew between the transmitted data and

source clock in GMII fashion.

When the eTSEC is configured for FIFO modes, all clocks are supplied from external sources to the

relevant eTSEC interface. That is, the transmit clock must be applied to the eTSECn TSECn_TX_CLK,

while the receive clock must be applied to pin TSECn_RX_CLK. The eTSEC internally uses the transmit

0.275

0.4

0.6

0.725

Vrx_diffpp_max/2

Vrx_diffpp_min/2

–Vrx_diffpp_min/2

–Vrx_diffpp_max/2

Time (UI)

Silicon

+ Package

C = CTX

R = 50

D+ Package

D– Package

D+ Package

MPC8544EBVTALF Datasheet(PDF) 30 Page - Freescale Semiconductor, Inc