TLC274 datasheet(4/42 Pages) TI

No. de pieza	TLC274

Descripción Electrónicos	LinCMOSE PRECISION QUAD OPERATIONAL AMPLIFIERS

PDF	42 Pages

Scroll/Zoom	100%

Fabricante Electrónico	TI [Texas Instruments]

Página de inicio	http://www.ti.com

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TLC274, TLC274A, TLC274B, TLC274Y, TLC279

LinCMOS

™ PRECISION QUAD OPERATIONAL AMPLIFIERS

SLOS092C – SEPTEMBER 1987 – REVISED MARCH 1998

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TLC274Y chip information

These chips, when properly assembled, display characteristics similar to the TLC274C. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (11) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

–

1OUT

1IN +

1IN –

VDD

(4)

(6)

(3)

(2)

(5)

(1)

–

(7)

2IN +

2IN –

2OUT

GND

–

3OUT

3IN +

3IN –

(13)

(10)

(9)

(12)

(8)

–

(14)

4OUT

4IN +

4IN –

108

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(9)

(10)

(11)

(12)

(13)

(14)

TLC274 Datasheet(PDF) 4 Page - Texas Instruments

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