TL3016, TL3016Y

ULTRA-FAST LOW-POWER

PRECISION COMPARATORS

SLCS130D – MARCH 1997 – REVISED MARCH 2000

2

POST OFFICE BOX 655303

TL3016Y chip information

This chip displays characteristics similar to the TL3016C. Thermal compression or ultrasonic bonding may be

used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon

preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 10 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

TERMINALS 1 AND 6 CAN BE

CONNECTED TO MULTIPLE PADS.

Q OUT

IN–

IN+

LATCH ENABLE

Q OUT

(5)

(2)

(3)

(1)

(6)

VCC+

GND

(7)

(8)

+

–

55

63

VCC –

(4)

(1)

(4)

(3)

(2)

(5)

(1)

(1)

(8)

(7)

(6)

(6)

(6)

COMPONENT COUNT

Bipolars

53

MOSFETs

49

Resistors

46

Capacitors

14