NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 5

15.01.2008

L825HW SERIES

10. SOLDERIND AND MOUNTING :

c) Never contact the ceramic with the iron tip

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

30~60s

60~120s

Figure 1. Re-flow Soldering

Preheating

230

150

180

250~260

Soldering

10s max.

Natural

cooling

d) 1.0mm tip diameter (max)

f) Limit soldering time to 3 secs.

Gradual

Cooling

Within 3secs.

Figure 2. Iron Soldering

Over 1min.

Soldering

Preheating

150

280

cooling

Natural

10-2.2 Soldering Iron (Figure 2) :

a soldering iron must be employed the following precautions are recommended.

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

Recommended temperature profiles for re-flow soldering in Figure 1.

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

a) Preheat circuit and products to 150°C.

air soldering tools.

10-2.1 Solder Re-flow :

Note :

b) 280°C tip temperature (max)

2.5

10-2. Soldering

2.5

3.7

10-1. Recommended PC Board Pattern

260

Products shall be positioned in the sideway direction against

PC board should be designed so that products are not sufficient

under mechanical stress as warping the board.

the mechanical stress to prevent failure.

HIGH CURRENT MOLDED POWER INDUCTORS