CDC921

133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS

WITH 3-STATE OUTPUTS

SCAS623 –MAY 27, 1999

6

POST OFFICE BOX 655303

– 0.5 V to 4.6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

– 0.5 V to 4.6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Voltage range applied to any output in the high-impedance state or power-off state,

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

– 18 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

– 50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–0

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

DERATING FACTOR†

TA = 70°C

TA = 85°C

PACKAGE

A

POWER RATNG

ABOVE TA = 25°C

A

POWER RATING

A

POWER RATING

DL

1315.7 mW

10.53 mW/

°C

842.1 mW

684.2 mW

† This is the inverse of the traditional junction-to-case thermal resistance (RθJA) and uses a board-mounted device

at 95

°C/W.

recommended operating conditions (see Note 2)

MIN

NOM†

MAX

UNIT

Supply voltage VDD

3.3 V

3.135

3.465

V

Supply voltage, VDD

2.5 V

2.375

2.625

V

High-level input voltage, VIH

2

VDD +

0.3 V

V

Low-level input voltage, VIL

GND –

0.3 V

0.8

V

Input voltage, VI

0

VDD

V

CPUx, CPU_DIV2

–12

High level output current IOH

APIC

–12

mA

High-level output current, IOH

48MHz, REFx

–14

mA

PCIx, PCI_F, 3V66x

–18

CPUx, CPU_DIV2

12

Low level output current IOL

APIC

12

mA

Low-level output current, IOL

48MHz, REFx

9

mA

PCIx, PCI_F, 3V66x

12

Reference frequency, f(XTAL)‡

Test mode

130

MHz

Crystal frequency, f(XTAL)§

Normal mode

13.8

14.318

14.8

MHz

Operating free-air temperature, TA

0

85

°C

NOTE 2: Unused inputs must be held high or low to prevent them from floating.

† All nominal values are measured at their respective nominal VDD values.

‡ Reference frequency is a test clock driven on the XIN input during the device test mode and normal mode. In test mode, XIN can be driven

externally up to f(XTAL) = 130 MHz. If XIN is driven externally, XOUT is floating.

§ This is a series fundamental crystal with fO = 14.31818 MHz.