LTC2921/LTC2922 Series

19

29212fa

F Package

20-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1650)

GN Package

16-Lead Plastic SSOP (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1641)

PACKAGE DESCRIPTIO

F20 TSSOP 0502

0.09 – 0.20

(.0036 – .0079)

0

° – 8°

0.45 – 0.75

(.018 – .030)

4.30 – 4.50**

(.169 – .177)

6.40

BSC

13

4

5

6 7 89 10

11

12

14 13

6.40 – 6.60*

(.252 – .260)

20 19 18 17 16 15

1.10

(.0433)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

2

MILLIMETERS

(INCHES)

DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED .152mm (.006") PER SIDE

DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE

*

**

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

RECOMMENDED SOLDER PAD LAYOUT

0.45

±0.05

0.65 TYP

4.50

±0.10

6.60

±0.10

1.05

±0.10

GN16 (SSOP) 0502

12

3

4

5

6

7

8

.229 – .244

(5.817 – 6.198)

.150 – .157**

(3.810 – 3.988)

16 15 14 13

.189 – .196*

(4.801 – 4.978)

12 11 10 9

.016 – .050

(0.406 – 1.270)

.015

± .004

(0.38

± 0.10)

× 45°

0

° – 8° TYP

.007 – .0098

(0.178 – 0.249)

.053 – .068

(1.351 – 1.727)

.008 – .012

(0.203 – 0.305)

.004 – .0098

(0.102 – 0.249)

.0250

(0.635)

BSC

.009

(0.229)

REF

.254 MIN

RECOMMENDED SOLDER PAD LAYOUT

.150 – .165

.0250 TYP

.0165

±.0015

.045

±.005

*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

INCHES

(MILLIMETERS)

NOTE:

1. CONTROLLING DIMENSION: INCHES

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.