LTC4352

14

4352f

DD Package

12-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1725 Rev A)

3.00 ±0.10

(4 SIDES)

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.40 ± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65 ± 0.10

0.75 ±0.05

R = 0.115

TYP

1

6

12

7

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DD12) DFN 0106 REV A

0.23 ± 0.05

PIN 1 NOTCH

R = 0.20 OR

0.25 × 45°

CHAMFER

2.38 ±0.10

2.25 REF

0.45 BSC

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.25 ± 0.05

2.25 REF

2.38 ±0.05

1.65 ±0.05

2.10 ±0.05

0.70 ±0.05

3.50 ±0.05

PACKAGE

OUTLINE

0.45 BSC

PACKAGE DESCRIPTION