Motor de Búsqueda de Datasheet de Componentes Electrónicos
  Spanish  ▼
ALLDATASHEET.ES

X  

Preview PDF HTML

MP3V5004GC7U Datasheet(PDF) 4 Page - Freescale Semiconductor, Inc

No. de pieza MP3V5004GC7U
Descripción Electrónicos  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  14 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricante Electrónico  FREESCALE [Freescale Semiconductor, Inc]
Página de inicio  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MP3V5004GC7U Datasheet(HTML) 4 Page - Freescale Semiconductor, Inc

  MP3V5004GC7U Datasheet HTML 1Page - Freescale Semiconductor, Inc MP3V5004GC7U Datasheet HTML 2Page - Freescale Semiconductor, Inc MP3V5004GC7U Datasheet HTML 3Page - Freescale Semiconductor, Inc MP3V5004GC7U Datasheet HTML 4Page - Freescale Semiconductor, Inc MP3V5004GC7U Datasheet HTML 5Page - Freescale Semiconductor, Inc MP3V5004GC7U Datasheet HTML 6Page - Freescale Semiconductor, Inc MP3V5004GC7U Datasheet HTML 7Page - Freescale Semiconductor, Inc MP3V5004GC7U Datasheet HTML 8Page - Freescale Semiconductor, Inc MP3V5004GC7U Datasheet HTML 9Page - Freescale Semiconductor, Inc Next Button
Zoom Inzoom in Zoom Outzoom out
 4 / 14 page
background image
Sensors
4
Freescale Semiconductor
MP3V5004G
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing
silicone gel which isolates the die from the environment. The
Freescale Semiconductor pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE
MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. SOP Footprint (Case 482)
Part Number
Case Type
Pressure (P1) Side Identifier
MP3V5004GC6U/T1
482A
Side with Port Attached
MP3V5004GC7U
482C
Side with Port Attached
MP3V5004GP
1369
Side with Port Attached
MP3V5004DP
1351
Side with Port Marking
MP3V5004GVP
1368
Stainless Steel Cap
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14


Datasheet Descarga

Go To PDF Page


Enlace URL



¿ALLDATASHEET es útil para Ud.?  [ DONATE ] 

Todo acerca de Alldatasheet   |   Publicidad   |   Contáctenos   |   Política de Privacidad   |   Enlace a la hoja de datos    |   Intercambio de Enlaces   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com