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ADV3200/ADV3201

Rev. 0 | Page 7 of

ABSOLUTE MAXIMUM RATINGS

POWER DISSIPATION

Table 5.

Parameter

Rating

Analog Supply Voltage

(VPOS − VNEG)

7.5 V

Digital Supply Voltage

(DVCC − DGND)

6 V

Ground Potential Difference

(VNEG − DGND)

+0.5 V to −4 V

Maximum Potential Difference

DVCC − VNEG

9.4 V

Disabled Outputs

ADV3200 (|VOSD − VOUT|)

<3 V

ADV3201

(|VOSD − (VOUT + VREF)/2|)

<3 V

|VCLAMP − VINxx|

6 V

VREF Input Voltage

ADV3200

VPOS − 3.5 V to VNEG + 3.5 V

ADV3201

VPOS − 4 V to VNEG + 4 V

Analog Input Voltage

VNEG to VPOS

Digital Input Voltage

DVCC

Output Voltage

(Disabled Analog Output)

(VPOS − 1 V) to (VNEG + 1 V)

Output Short-Circuit Duration

Momentary

Output Short-Circuit Current

45 mA

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature

(Soldering 10 sec)

300°C

Junction Temperature

150°C

The ADV3200/ADV3201 are operated with ±2.5 V, 5 V, or

±3.3 V supplies and can drive loads down to 150 Ω, resulting in

a large range of possible power dissipations. For this reason,

extra care must be taken to derate the operating conditions

based on ambient temperature.

The ADV3200/ADV3201 are packaged in a 176-lead exposed

pad LQFP. The junction-to-ambient thermal impedance (θJA) of

the ADV3200/ADV3201 is 16°C/W. For long-term reliability,

the maximum allowed junction temperature of the die should

not exceed 150°C. Temporarily exceeding this limit may cause a

shift in parametric performance due to a change in stresses

exerted on the die by the package. Exceeding a junction

temperature of 175°C for an extended period can result in

device failure. Figure 4 shows the range of allowed internal die

power dissipations that meet these conditions over the −40°C to

+85°C ambient temperature range. When using Figure 4, do not

include external load power in the maximum power calculation,

but do include load current dropped on the die output

transistors.

AMBIENT TEMPERATURE (°C)

TJ = 150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

ESD CAUTION

Table 6. Thermal Resistance

Package Type

θJA

Unit

176-Lead LQFP_EP

°C/W

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